US 11,844,176 B2
Printed circuit board
Jonghyun Seok, Seoul (KR); and Kyeongseon Park, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 16, 2022, as Appl. No. 17/672,979.
Claims priority of application No. 10-2021-0082387 (KR), filed on Jun. 24, 2021; and application No. 10-2021-0132221 (KR), filed on Oct. 6, 2021.
Prior Publication US 2022/0418105 A1, Dec. 29, 2022
Int. Cl. H05K 1/11 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 2201/09409 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a base substrate having a first side and a second side, extending in a first direction and parallel to each other, and a third side and a fourth side extending in a second direction, perpendicular to the first direction, and parallel to each other;
a pad region having a plurality of pad patterns disposed on one surface of the base substrate; and
a dummy region having a plurality of conductive dummy patterns separated from the plurality of pad patterns to be disposed on the one surface of the base substrate, wherein:
the pad region includes a first edge region adjacent to an intersection of the first side and the third side, and a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate, and
the dummy region includes a third edge region adjacent to an intersection of the first side and the fourth side, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.