CPC H03K 17/302 (2013.01) [H01L 27/0629 (2013.01); H01L 29/0696 (2013.01); H01L 29/66734 (2013.01); H01L 29/7808 (2013.01); H01L 29/7813 (2013.01)] | 20 Claims |
1. An integrated device, comprising:
at least one MOS transistor integrated on a die of semiconductor material, the MOS transistor including:
a plurality of cells, each of the cells including:
a source region;
a gate element of electrical conductive material; and
a gate insulating layer of electrically insulating material insulating the gate element from the semiconductor material of the die;
a source contact coupled with the source regions; and
a gate contact coupled with the gate elements,
wherein one or more selected cells of the plurality of cells includes:
a disabling structure interposed between a coupled gate portion of the gate element coupled with the gate contact and an uncoupled gate portion of the gate element uncoupled from the gate contact, the disabling structure having an intervention voltage higher than a threshold voltage of the MOS transistor.
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