US 11,843,153 B2
Use of enhanced performance ultraconductive copper materials in cylindrical configurations and methods of forming ultraconductive copper materials
Martin W. Bayes, Hopkinton, MA (US); Gokce Gulsoy, San Jose, CA (US); Ting Gao, Palo Alto, CA (US); David Bruce Sarraf, Elizabethtown, PA (US); Chad William Morgan, Carneys Point, NJ (US); and Rodney Ivan Martens, Mechanicsburg, PA (US)
Assigned to TE CONNECTIVITY SOLUTIONS GMBH, Schaffhausen (CH)
Filed by TE Connectivity Services GmbH, Schaffhausen (CH)
Filed on Mar. 12, 2020, as Appl. No. 16/816,968.
Claims priority of provisional application 62/817,108, filed on Mar. 12, 2019.
Claims priority of provisional application 62/817,102, filed on Mar. 12, 2019.
Claims priority of provisional application 62/817,112, filed on Mar. 12, 2019.
Prior Publication US 2020/0295427 A1, Sep. 17, 2020
Int. Cl. H01P 3/06 (2006.01); H01B 1/02 (2006.01); H01P 11/00 (2006.01); C23C 16/26 (2006.01)
CPC H01P 3/06 (2013.01) [H01B 1/026 (2013.01); H01P 11/005 (2013.01); C23C 16/26 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An ultraconductive copper composite cylindrical conduit having an outer surface and enhanced RF conductivity, said conduit comprising an inner core, a shell comprising copper placed directly on and surrounding said inner core, a graphene layer directly on said shell, and an outer copper layer being deposited on said graphene layer to form the outer surface, wherein said shell, graphene layer and outer copper layer are sufficiently close to the outer surface thereby enhancing the RF conductivity of the conduit over a cylindrical conduit comprising copper alone.