US 11,843,087 B2
Vertical solid-state transducers and high voltage solid-state transducers having buried contacts and associated systems and methods
Vladimir Odnoblyudov, Eagle, ID (US); and Martin F. Schubert, Mountain View, CA (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Jan. 19, 2023, as Appl. No. 18/156,994.
Application 14/850,715 is a division of application No. 14/607,839, filed on Jan. 28, 2015, granted, now 9,159,896, issued on Oct. 13, 2015.
Application 14/607,839 is a division of application No. 13/708,526, filed on Dec. 7, 2012, granted, now 8,963,121, issued on Feb. 24, 2015.
Application 18/156,994 is a continuation of application No. 17/132,546, filed on Dec. 23, 2020, granted, now 11,563,158.
Application 17/132,546 is a continuation of application No. 16/669,785, filed on Oct. 31, 2019, granted, now 10,879,444, issued on Dec. 29, 2020.
Application 16/669,785 is a continuation of application No. 16/167,280, filed on Oct. 22, 2018, granted, now 10,475,976, issued on Nov. 12, 2019.
Application 16/167,280 is a continuation of application No. 15/658,202, filed on Jul. 24, 2017, granted, now 10,134,969, issued on Nov. 20, 2018.
Application 15/658,202 is a continuation of application No. 15/019,748, filed on Feb. 9, 2016, granted, now 9,728,696, issued on Aug. 8, 2017.
Application 15/019,748 is a continuation of application No. 14/850,715, filed on Sep. 10, 2015, granted, now 9,293,639, issued on Mar. 22, 2016.
Prior Publication US 2023/0163266 A1, May 25, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/62 (2010.01); H01L 21/78 (2006.01); H01L 27/15 (2006.01); H01L 33/38 (2010.01); H01L 27/04 (2006.01); H01L 33/00 (2010.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/40 (2010.01); H01L 33/64 (2010.01); H01L 25/075 (2006.01); H01L 33/58 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 21/78 (2013.01); H01L 25/0753 (2013.01); H01L 27/04 (2013.01); H01L 27/156 (2013.01); H01L 33/005 (2013.01); H01L 33/0025 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/382 (2013.01); H01L 33/405 (2013.01); H01L 33/64 (2013.01); H01L 33/647 (2013.01); H01L 33/0095 (2013.01); H01L 33/58 (2013.01); H01L 33/642 (2013.01); H01L 33/644 (2013.01); H01L 2224/73265 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A solid-state transducer (SST) die, comprising:
a first terminal;
a second terminal;
a plurality of SST junctions coupled in series between the first terminal and the second terminal; and
a thermal pad vertically aligned with and spaced apart from the plurality of SST junctions.