US 11,842,991 B2
Semiconductor device and method of forming a 3D interposer system-in-package module
DeokKyung Yang, Incheon Si (KR); OhHan Kim, In-cheon (KR); HeeSoo Lee, Kyunggi-do (KR); HunTeak Lee, Gyeongi-do (KR); InSang Yoon, Seoul (KR); and Il Kwon Shim, Singapore (SG)
Assigned to STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed by STATS ChipPAC Pte. Ltd., Singapore (SG)
Filed on Aug. 11, 2020, as Appl. No. 16/990,887.
Application 16/990,887 is a continuation of application No. 15/976,455, filed on May 10, 2018, granted, now 10,797,039.
Application 15/976,455 is a continuation in part of application No. 15/830,644, filed on Dec. 4, 2017, granted, now 10,388,637, issued on Aug. 20, 2019.
Claims priority of provisional application 62/431,219, filed on Dec. 7, 2016.
Prior Publication US 2020/0373289 A1, Nov. 26, 2020
Int. Cl. H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01L 25/065 (2023.01); H01L 25/16 (2023.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/50 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/552 (2013.01); H01L 24/17 (2013.01); H01L 24/83 (2013.01); H01L 25/0652 (2013.01); H01L 25/16 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05111 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05139 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48179 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/97 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/3025 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method of making a semiconductor device, comprising:
providing a first substrate;
disposing a first electrical component over the first substrate with a first terminal of the first electrical component oriented toward the first substrate and a second terminal of the first electrical component oriented away from the first substrate, wherein the first electrical component is a discrete active or passive device;
disposing a first solder material between the first terminal of the first electrical component and the first substrate;
disposing a second substrate over the first substrate with the first electrical component between the first substrate and second substrate;
disposing a second solder material between the second terminal of the first electrical component and the second substrate; and
depositing an encapsulant between the first substrate and second substrate and around the first electrical component.