US 11,842,974 B2
Solder material and method for die attachment
Angelo Gulino, Cranbury, NJ (US); Bogdan Bankiewicz, Philadelphia, PA (US); Oscar Khaselev, Monmouth Junction, NJ (US); Anna Lifton, Bridgewater, NJ (US); Michael T. Marczi, Chester, NJ (US); Girard Sidone, Bordentown, NJ (US); Paul Salerno, Bridgewater, NJ (US); and Paul J. Koep, Madison, NJ (US)
Assigned to Alpha Assembly Solutions Inc., Waterbury, CT (US)
Appl. No. 16/612,883
Filed by Alpha Assembly Solutions Inc., Waterbury, CT (US)
PCT Filed May 11, 2018, PCT No. PCT/US2018/032325
§ 371(c)(1), (2) Date Nov. 12, 2019,
PCT Pub. No. WO2018/209237, PCT Pub. Date Nov. 15, 2018.
Claims priority of provisional application 62/505,463, filed on May 12, 2017.
Prior Publication US 2020/0203304 A1, Jun. 25, 2020
Int. Cl. H01L 23/00 (2006.01); B23K 35/26 (2006.01); B23K 35/30 (2006.01); C22C 13/00 (2006.01); B23K 101/42 (2006.01)
CPC H01L 24/29 (2013.01) [B23K 35/262 (2013.01); B23K 35/302 (2013.01); C22C 13/00 (2013.01); H01L 24/83 (2013.01); B23K 2101/42 (2018.08); H01L 2224/29209 (2013.01); H01L 2224/29211 (2013.01); H01L 2224/29216 (2013.01); H01L 2224/29239 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29324 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01082 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A solder material comprising:
a) a solder alloy, and
b) a thermal conductivity modifying component,
wherein the solder alloy is selected from the group consisting of high lead alloys, SnAg alloys, SnAgCu alloys, SnPb alloys, and combinations of one or more of the foregoing;
wherein the thermal conductivity modifying component is in the form of a wire;
wherein the thermal conductivity modifying component is tin over nickel over aluminum; and
wherein the solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K.