US 11,842,954 B2
Method of manufacturing semiconductor devices and corresponding semiconductor device
Federico Giovanni Ziglioli, Pozzo D'Adda (IT); Alberto Pintus, Gessate (IT); and Pierangelo Magni, Villasanta (IT)
Assigned to STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed by STMicroelectronics S.r.l., Agrate Brianza (IT)
Filed on Aug. 15, 2022, as Appl. No. 17/887,838.
Application 17/887,838 is a division of application No. 17/108,270, filed on Dec. 1, 2020, granted, now 11,417,590, issued on Aug. 16, 2022.
Claims priority of application No. 102019000022632 (IT), filed on Dec. 2, 2019.
Prior Publication US 2022/0392830 A1, Dec. 8, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/49586 (2013.01) [H01L 21/481 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/49506 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a plastic substrate patterned to have a leadframe shape including a plastic die mounting location and a plurality of plastic leads;
metallic traces of activated laser direct structuring material at selected areas of said plurality of plastic leads;
plating on the metallic traces to provide electrically-conductive paths;
a semiconductor die attached at said plastic die mounting location;
electrical bonding between the semiconductor die and selected ones of said electrically-conductive paths; and
package material molded onto said semiconductor die attached onto said plastic die mounting location and a portion of said plurality of plastic leads.