US 11,842,950 B2
Package module
Yongjin Park, Suwon-si (KR); Myungsam Kang, Suwon-si (KR); and Younggwan Ko, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Mar. 2, 2022, as Appl. No. 17/685,227.
Application 17/685,227 is a continuation of application No. 16/590,570, filed on Oct. 2, 2019, abandoned.
Claims priority of application No. 10-2018-0151366 (KR), filed on Nov. 29, 2018.
Prior Publication US 2022/0246506 A1, Aug. 4, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01)
CPC H01L 23/49534 (2013.01) [H01L 23/3157 (2013.01); H01L 23/49531 (2013.01); H01L 23/49537 (2013.01); H01L 23/5226 (2013.01); H01L 24/09 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02379 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package module comprising:
a connection structure including one or more redistribution layers;
a semiconductor chip disposed on the connection structure and having a connection pad electrically connected to the one or more redistribution layers;
a plurality of electronic components disposed on the connection structure and electrically connected to the one or more redistribution layers;
one or more frames disposed on the connection structure and including a plurality of insulating layers and a plurality of conductor vias, the plurality of insulating layers being on the connection structure, the plurality of conductor vias penetrating through the plurality of insulating layers and electrically connected to the one or more redistribution layers;
a first metal layer covering at least one side surface of the plurality of insulating layers;
a first encapsulant disposed on the connection structure, and respectively covering at least portions of the plurality of electronic components, the first metal layer, and the one or more frames;
a second encapsulant covering at least a portion of each of the semiconductor chip and the first encapsulant; and
a second metal layer disposed directly between the first encapsulant and the second encapsulant,
wherein the first metal layer has an outer side surface exposed to the outside of the package module, a first side surface connected to the outer side surface, and a second side surface opposite to the first side surface,
wherein one of the plurality of insulating layers has an outer side surface which is coplanar with the outer side surface of the first metal layer and a side surface which is in contact with the first side surface of the first metal layer, and
wherein the first encapsulant has an outer side surface which is coplanar with the outer side surface of the first metal layer and a side surface which is in contact with the second side surface of the first metal layer.