US 11,842,945 B2
Chip on film package and display apparatus including the same
Jaemin Jung, Seoul (KR); Sanguk Han, Asan-si (KR); and Yoonha Jung, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Oct. 22, 2021, as Appl. No. 17/508,483.
Claims priority of application No. 10-2020-0143874 (KR), filed on Oct. 30, 2020.
Prior Publication US 2022/0139799 A1, May 5, 2022
Int. Cl. H01L 25/18 (2023.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H05K 1/14 (2006.01)
CPC H01L 23/3735 (2013.01) [H01L 23/3733 (2013.01); H01L 23/3737 (2013.01); H01L 23/4985 (2013.01); H01L 25/18 (2013.01); H05K 1/0204 (2013.01); H05K 1/189 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/73204 (2013.01); H05K 1/147 (2013.01); H05K 2201/10128 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A chip-on-film package comprising:
a base film comprising an upper surface and a lower surface opposite to the upper surface;
a semiconductor chip mounted on the upper surface of the base film;
a heat emission layer disposed on the lower surface of the base film to at least partially overlap the semiconductor chip in a thickness direction, wherein the heat emission layer is contiguously formed;
an insulating layer disposed on a lower surface of the heat emission layer; and
a protective layer surrounding side and lower surfaces of the insulating layer.