US 11,842,943 B2
Electronic systems with inverted circuit board with heat sink to chassis attachment
Barrett M. Faneuf, Beaverton, OR (US); Phil Geng, Washougal, WA (US); Kenan Arik, Hillsboro, OR (US); David Shia, Portland, OR (US); Casey Winkel, Hillsboro, OR (US); Sandeep Ahuja, Portland, OR (US); Eric D. McAfee, Portland, OR (US); Jeffory L. Smalley, Olympia, WA (US); Minh T. D. Le, North Plains, OR (US); Ralph V. Miele, Hillsboro, OR (US); Marc Milobinski, Scappoose, OR (US); Aaron P. Anderson, Beaverton, OR (US); Brendan T. Pavelek, Portland, OR (US); Fernando Gonzalez Lenero, Zapopan (MX); and Carlos Alvizo Flores, Guadalajara (MX)
Assigned to INTEL CORPORATION, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 5, 2020, as Appl. No. 16/986,122.
Claims priority of provisional application 62/883,532, filed on Aug. 6, 2019.
Prior Publication US 2021/0043537 A1, Feb. 11, 2021
Int. Cl. H01L 23/367 (2006.01); H05K 7/20 (2006.01); H05K 7/14 (2006.01); G11C 5/06 (2006.01)
CPC H01L 23/3677 (2013.01) [G11C 5/06 (2013.01); H05K 7/1422 (2013.01); H05K 7/20509 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a chassis,
a semiconductor chip cooling component that is rigidly fixed to the chassis;
a semiconductor package having a semiconductor chip and a lid, the lid in contact with the semiconductor chip cooling component; and
an electronic circuit board, the semiconductor package electro-mechanically attached to the electronic circuit board, the electronic circuit board supported by the chassis, the semiconductor chip cooling component supported by the chassis independent of the electronic circuit board.