US 11,842,936 B2
Underfill structure for semiconductor packages and methods of forming the same
Yu-Wei Chen, Hsinchu (TW); Li-Chung Kuo, Taipei (TW); Ying-Ching Shih, Hsinchu (TW); Szu-Wei Lu, Hsinchu (TW); Jing-Cheng Lin, Hsinchu (TW); Long Hua Lee, Taipei (TW); and Kuan-Yu Huang, Taipei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 26, 2021, as Appl. No. 17/384,923.
Application 17/384,923 is a division of application No. 16/177,637, filed on Nov. 1, 2018, granted, now 11,075,133, issued on Jul. 27, 2021.
Claims priority of provisional application 62/692,177, filed on Jun. 29, 2018.
Prior Publication US 2021/0358825 A1, Nov. 18, 2021
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/3135 (2013.01) [H01L 21/563 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 25/0657 (2013.01); H01L 2224/16225 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/0652 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device comprising:
a first package comprising:
a first integrated circuit die;
an encapsulant around the first integrated circuit die; and
a redistribution layer over the encapsulant and the first integrated circuit die;
a plurality of functional connectors;
a second package bonded to the first package by the plurality of functional connectors, wherein the functional connectors and the redistribution layer electrically couple a second integrated circuit die of the second package to the first integrated circuit die;
a first underfill between the first package and the second package, the first underfill surrounding the plurality of functional connectors, wherein a first width of the first underfill adjacent the first package is less than a second width of the first underfill adjacent the second package; and
a second underfill surrounding the first underfill, the second underfill having a different material composition than the first underfill, wherein a topmost extent of the second underfill is disposed above a topmost surface of the first underfill.