US 11,842,905 B2
Stacked substrate manufacturing method, stacked substrate manufacturing apparatus, stacked substrate manufacturing system, and substrate processing apparatus
Isao Sugaya, Kawasaki (JP); and Hajime Mitsuishi, Yokohama (JP)
Assigned to Nikon Corporation, Tokyo (JP)
Filed by NIKON CORPORATION, Tokyo (JP)
Filed on Jan. 10, 2019, as Appl. No. 16/244,729.
Application 16/244,729 is a continuation of application No. PCT/JP2017/023942, filed on Jun. 29, 2017.
Claims priority of application No. 2016-138029 (JP), filed on Jul. 12, 2016.
Prior Publication US 2019/0148184 A1, May 16, 2019
Int. Cl. H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67092 (2013.01) [H01L 21/67253 (2013.01); H01L 21/67271 (2013.01); H01L 21/67288 (2013.01); H01L 21/681 (2013.01); H01L 21/6831 (2013.01); H01L 21/68714 (2013.01); H01L 22/20 (2013.01); H01L 22/12 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A stacked substrate manufacturing method by bonding a first substrate and a second substrate, the stacked substrate manufacturing method comprising:
obtaining information about curving of the first substrate; and
at least one of:
(i) estimating, based on the information about curving, an amount of distortion occurring in the first substrate while a contact region formed between the first substrate and the second substrate is spreading; and
(ii) calculating, based on the information about curving, an amount of misalignment between the first substrate and the second substrate, the misalignment occurring while the contact region formed between the first substrate and the second is spreading.