US 11,842,861 B2
Method of manufacturing switch cap, switch cap, and switch device
Chuzo Taniguchi, Kyoto (JP); Eiji Kawashima, Kyoto (JP); and Jun Sasaki, Kyoto (JP)
Assigned to NISSHA CO., LTD., Kyoto (JP)
Appl. No. 17/995,342
Filed by NISSHA CO., LTD., Kyoto (JP)
PCT Filed Mar. 22, 2021, PCT No. PCT/JP2021/011638
§ 371(c)(1), (2) Date Oct. 3, 2022,
PCT Pub. No. WO2021/205854, PCT Pub. Date Oct. 14, 2021.
Claims priority of application No. 2020-068519 (JP), filed on Apr. 6, 2020.
Prior Publication US 2023/0123719 A1, Apr. 20, 2023
Int. Cl. H01H 13/14 (2006.01); H01H 11/00 (2006.01); H01H 13/20 (2006.01); B60Q 9/00 (2006.01); B62D 1/04 (2006.01)
CPC H01H 13/14 (2013.01) [H01H 11/00 (2013.01); H01H 13/20 (2013.01); B60Q 9/00 (2013.01); B62D 1/046 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method of manufacturing a switch cap attached to a switch device that performs predetermined switching, the method comprising:
a step (a) of molding a transmission member by first injection molding using a first model, the transmission member moving together with a three-dimensional cap main body for the switching to transmit the movement of the cap main body to a predetermined location of the switch device;
a step (b) of molding a second model into the first model to perform second injection molding, and molding the cap main body having an abutting portion that an operator abuts for the switching and moving by a force applied to the abutting portion from the operator;
a step (c) of setting a flexible printed circuit board at a predetermined location of the first model before the step (a) or before the step (b), the flexible printed circuit board including a sensor that detects abutting or approach of the operator to the abutting portion; and
fixing the flexible printed circuit board by the cap main body and the transmission member so that the sensor is disposed at a predetermined location of the abutting portion by the step (a), the step (b), and the step (c).