US 11,842,856 B2
Multilayer electronic component
Hye Won Kim, Suwon-si (KR); Won Kuen Oh, Suwon-si (KR); Chae Dong Lee, Suwon-si (KR); Og Soon Kim, Suwon-si (KR); and Jung Won Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Mar. 29, 2022, as Appl. No. 17/707,384.
Claims priority of application No. 10-2021-0194081 (KR), filed on Dec. 31, 2021.
Prior Publication US 2023/0215649 A1, Jul. 6, 2023
Int. Cl. H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/012 (2006.01); H01G 4/008 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and internal electrodes; and
external electrodes disposed on the body and connected to the internal electrodes,
wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.