US 11,842,853 B2
Multilayered electronic component and method of manufacturing the same
Hyung Jong Choi, Suwon-si (KR); Yoo Jeong Lee, Suwon-si (KR); Kwan Young Son, Suwon-si (KR); Woo Kyung Sung, Suwon-si (KR); Kyu Sik Park, Suwon-si (KR); Myung Jun Park, Suwon-si (KR); and Kwang Yeun Won, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Sep. 9, 2021, as Appl. No. 17/470,251.
Claims priority of application No. 10-2020-0178296 (KR), filed on Dec. 18, 2020.
Prior Publication US 2022/0199328 A1, Jun. 23, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 4/224 (2006.01); H01G 4/248 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A multilayer electronic component, comprising:
an electronic component body including a body having a dielectric layer and an internal electrode; and an external electrode disposed on the body, and
a coating layer disposed on an external surface of the electronic component body, and containing one or more of a silicone-based hydrocarbon compound and a fluorine-based hydrocarbon compound, the coating layer having an average thickness of 5 nm or more and 15 nm or less,
wherein the body comprises a capacitance formation portion in which the dielectric layer and the internal electrode are alternately disposed, a cover portion disposed above and below the capacitance formation portion, and a margin portion disposed on both side surfaces of the capacitance formation portion,
one or more of the cover portion and the margin portion comprise a pore extending from an external surface of the body towards the capacitance formation portion, and
the coating layer extends from the external surface of the electronic component body onto a side surface of the pore, while not covering a central portion the pore on a level of the external surface of the electronic component body.