US 11,842,826 B2
Additive manufacturing for integrated circuit assembly connector support structures
Adel Elsherbini, Tempe, AZ (US); Feras Eid, Chandler, AZ (US); Johanna Swan, Scottsdale, AZ (US); and Georgios Dogiamis, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 23, 2020, as Appl. No. 16/909,264.
Prior Publication US 2021/0398715 A1, Dec. 23, 2021
Int. Cl. H01L 21/786 (2006.01); H01B 13/22 (2006.01); H01B 13/00 (2006.01); H01B 7/00 (2006.01); H01B 7/18 (2006.01); H01L 21/768 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01)
CPC H01B 13/0036 (2013.01) [H01B 7/0018 (2013.01); H01B 7/1805 (2013.01); H01B 13/002 (2013.01); H01B 13/0026 (2013.01); H01B 13/22 (2013.01); H01L 21/76885 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit assembly, comprising:
an electronic board;
an electronic substrate having a first surface and an opposing second surface, wherein the second surface of the electronic substrate is in electrical contact with the electronic board;
an integrated circuit device having a first surface and an opposing second surface, wherein the first surface of the integrated circuit device is electrically attached to the first surface of the electronic substrate;
a heat dissipation device in thermal contact with the second surface of the integrated circuit device;
a side mount module comprising a side mount connector electrically attached to the electronic board and a side mount bridge electrically attached to the side mount connector and the first surface of the electronic substrate; and
an additive support structure extending between and fused to the heat dissipation device and the side mount module.