US 11,842,790 B2
Page buffer circuit and memory device including the same
Yongsung Cho, Suwon-si (KR); Inho Kang, Suwon-si (KR); Taehyo Kim, Suwon-si (KR); Jeunghwan Park, Suwon-si (KR); and Jinwoo Park, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Mar. 23, 2023, as Appl. No. 18/125,260.
Application 18/125,260 is a continuation of application No. 17/207,398, filed on Mar. 19, 2021, granted, now 11,646,064.
Claims priority of application No. 10-2020-0089163 (KR), filed on Jul. 17, 2020.
Prior Publication US 2023/0223056 A1, Jul. 13, 2023
Int. Cl. G11C 7/10 (2006.01); G11C 7/12 (2006.01)
CPC G11C 7/1039 (2013.01) [G11C 7/1048 (2013.01); G11C 7/1057 (2013.01); G11C 7/1084 (2013.01); G11C 7/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory device comprising:
a memory cell area including a plurality of memory cells and a first metal pad; and
a periphery circuit area comprising a second metal pad, the periphery circuit area vertically connected to the memory cell area via the first metal pad and the second metal pad,
wherein the periphery circuit area further comprises a page buffer circuit comprising:
a plurality of page buffer units in a first horizontal direction, the plurality of page buffer units being connected to the memory cells via a plurality of bit lines; and
a plurality of cache latches in the first horizontal direction, the plurality of cache latches corresponding to each of the plurality of page buffer units and connected to a combined sensing node,
wherein each of the plurality of page buffer units comprises a pass transistor connected to a sensing node of each of the plurality of page buffer units, the sensing node electrically connected to a corresponding bit line, and
wherein the sensing nodes included in the plurality of page buffer units and the combined sensing node are electrically connected to each other through the pass transistors included in the plurality of page buffer units.