US 11,842,561 B2
Protective film and electronic device including same
Yunjang Jin, Gyeonggi-do (KR); Youjin Kim, Gyeonggi-do (KR); Suna Kim, Gyeonggi-do (KR); Min Park, Gyeonggi-do (KR); Bongjae Rhee, Gyeonggi-do (KR); and Yongwon Lee, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Appl. No. 17/277,787
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
PCT Filed Sep. 20, 2019, PCT No. PCT/KR2019/012279
§ 371(c)(1), (2) Date Mar. 19, 2021,
PCT Pub. No. WO2020/060318, PCT Pub. Date Mar. 26, 2020.
Claims priority of application No. 10-2018-0113816 (KR), filed on Sep. 21, 2018.
Prior Publication US 2021/0350109 A1, Nov. 11, 2021
Int. Cl. G06V 40/13 (2022.01); G06F 3/041 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01)
CPC G06V 40/1329 (2022.01) [B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); G06F 3/041 (2013.01); G06V 40/1306 (2022.01); B32B 2307/732 (2013.01); B32B 2457/208 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A protective film configured to be attached to an electronic device equipped with an ultrasonic fingerprint recognition sensor, the protective film comprising:
a first adhesive layer configured to be attached to a front plate of the electronic device; and
a first substrate layer stacked on the first adhesive layer and covering the front plate,
wherein at least one of the first adhesive layer and the first substrate layer is formed to have a thickness of ½nλ (where n is an integer n>0) with respect to a wavelength (λ) of an ultrasonic wave emitted from the ultrasonic fingerprint recognition sensor of the electronic device.