US 11,841,692 B2
Variable loop control feature
Venkatanarayana Shankaramurthy, San Jose, CA (US); Anton Baryshnikov, Campbell, CA (US); Brett Berens, San Jose, CA (US); Mitesh Sanghvi, Sunnyvale, CA (US); and Shuang Liu, Saratoga, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Sep. 16, 2022, as Appl. No. 17/946,936.
Application 17/946,936 is a continuation of application No. 17/326,984, filed on May 21, 2021, granted, now 11,449,026.
Claims priority of provisional application 63/030,716, filed on May 27, 2020.
Prior Publication US 2023/0014145 A1, Jan. 19, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G05B 19/18 (2006.01); B33Y 50/02 (2015.01)
CPC G05B 19/182 (2013.01) [B33Y 50/02 (2014.12); G05B 2219/49013 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
identifying a recipe for depositing a plurality of layers on a substrate in a processing chamber of a substrate processing system, wherein the recipe comprises a plurality of iterations of a set of one or more processes, and wherein each iteration of the plurality of iterations is for depositing at least one layer of the plurality of layers;
determining a plurality of changes to substrate processing parameters for depositing the at least one layer on the substrate to cause layer-to-layer thickness uniformity, wherein each of the plurality of changes corresponds to a respective iteration of the plurality of iterations and is associated with a relative position of a corresponding layer of the plurality of layers; and
causing the plurality of layers to be deposited on one or more substrates based on the recipe and the plurality of changes.