CPC G03F 7/039 (2013.01) [G03F 7/16 (2013.01); G03F 7/2002 (2013.01); G03F 7/30 (2013.01); H01L 21/0274 (2013.01)] | 20 Claims |
1. A method of forming a pattern on a substrate, the method comprising:
forming a first layer on an underlying layer of the substrate, the first layer patterned to have a first structure;
depositing a grafting material on side surfaces of the first structure, the grafting material including a solubility-shifting material;
diffusing the solubility-shifting material by a predetermined distance into a neighboring structure that abuts the solubility-shifting material, the solubility-shifting material changing solubility of the neighboring structure in a developer; and
removing soluble portions of the neighboring structure using the developer to form a second structure, wherein
the first structure comprises a first opening of the first layer,
the neighboring structure is a portion of the first layer,
the first layer comprises a photoresist material, and
the second structure comprises a second opening of the first layer, wherein a latent pattern of the second opening is formed by patterned exposure of the first layer to actinic radiation prior to diffusing the solubility-shifting material.
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