US 11,841,447 B2
3D angle of arrival capability in electronic devices with adaptability via memory augmentation
Khuong N. Nguyen, Frisco, TX (US); Yuming Zhu, Plano, TX (US); and Neha Dawar, Plano, TX (US)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 22, 2021, as Appl. No. 17/559,872.
Claims priority of provisional application 63/134,366, filed on Jan. 6, 2021.
Prior Publication US 2022/0214418 A1, Jul. 7, 2022
Int. Cl. G01S 3/04 (2006.01); G01S 3/48 (2006.01); G01S 3/22 (2006.01); G01S 3/50 (2006.01); G06N 3/044 (2023.01)
CPC G01S 3/043 (2013.01) [G01S 3/22 (2013.01); G01S 3/48 (2013.01); G01S 3/50 (2013.01); G06N 3/044 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a processor configured to:
obtain signal information based on wireless signals received from a target electronic device via a first antenna pair and a second antenna pair, wherein the first and second antenna pairs are aligned along different axes and wherein the signal information includes channel information, range information, a first angle of arrival (AoA) of the wireless signals based on the first antenna pair, and a second AoA of the wireless signals based on the second antenna pair;
obtain tagging information that identifies an environment in which the electronic device is located;
generate encoded information from a memory module based on the tagging information;
initialize a field of view (FoV) classifier based on the encoded information; and
determine whether the target electronic device is in a FoV of the electronic device based on the FoV classifier operating on the signal information.