US 11,841,392 B2
Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
Karthik Ranganathan, San Jose, CA (US); Gregory Cruzan, San Jose, CA (US); Samer Kabbani, San Jose, CA (US); Gilberto Oseguera, San Jose, CA (US); Rohan Gupte, San Jose, CA (US); Homayoun Rezai, San Jose, CA (US); Kenneth Santiago, San Jose, CA (US); and Marc Ghazvini, San Jose, CA (US)
Assigned to Advantest Test Solutiions, Inc., San Jose, CA (US)
Filed by ADVANTEST TEST SOLUTIONS, INC., San Jose, CA (US)
Filed on Jun. 3, 2022, as Appl. No. 17/832,348.
Application 17/832,348 is a continuation of application No. 16/986,037, filed on Aug. 5, 2020, granted, now 11,493,551.
Claims priority of provisional application 63/042,359, filed on Jun. 22, 2020.
Prior Publication US 2022/0299563 A1, Sep. 22, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 31/28 (2006.01); G01R 31/319 (2006.01); G01R 31/317 (2006.01)
CPC G01R 31/2844 (2013.01) [G01R 31/2863 (2013.01); G01R 31/2875 (2013.01); G01R 31/2877 (2013.01); G01R 31/31713 (2013.01); G01R 31/31905 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A testing apparatus comprising:
a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises:
a socket to hold a DUT;
a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT;
a superstructure operable to contain the discrete active thermal interposer, wherein the discrete active thermal interposer is a distinct component separate from the superstructure and separate from the socket; and
an actuation mechanism operable to provide force to bring the discrete active thermal interposer in the thermal contact with the DUT.