US 11,841,280 B2
Mapping temperatures across a surface
Benjamin Sullivan, Seattle, WA (US); Siyuan Ma, Redmond, WA (US); James David Holbery, Bellevue, WA (US); Collin Alexander Ladd, Sammamish, WA (US); and Kelly Marie Bogan, Redmond, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Feb. 22, 2021, as Appl. No. 17/249,170.
Application 17/249,170 is a continuation of application No. 15/647,080, filed on Jul. 11, 2017, granted, now 10,935,436.
Prior Publication US 2021/0172809 A1, Jun. 10, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. G01K 7/04 (2006.01); A41D 1/00 (2018.01); A61B 5/01 (2006.01); G01K 3/14 (2006.01); A61B 5/00 (2006.01); A63B 71/00 (2006.01); G01K 1/14 (2021.01)
CPC G01K 7/04 (2013.01) [A41D 1/002 (2013.01); A61B 5/015 (2013.01); A61B 5/6804 (2013.01); A63B 71/00 (2013.01); G01K 1/14 (2013.01); G01K 3/14 (2013.01); A41D 2500/30 (2013.01); A63B 2230/50 (2013.01); G01K 2213/00 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A computing device, comprising:
a flexible exterior surface material;
a sensing structure integrated with the flexible exterior surface material, the sensing structure comprising a plurality of individually readable sensing junctions, the sensing structure comprising a line of a first conductive material extending across an area of the flexible exterior surface material, and a plurality of lines of a second conductive material each intersecting the line of the first conductive material at a corresponding sensing junction, wherein each line of the plurality of lines of the second conductive material comprises a single junction with the line of the first conductive material to form a sensing junction;
a processor; and
a memory storing instructions executable by the processor to,
monitor the sensing structure to detect an input at one or more of the individually readable sensing junctions, and
perform an action on the computing device in response to detecting the input.