US 11,840,648 B2
Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material
Emi Miyazawa, Tokyo (JP); Tsuyoshi Hayasaka, Tokyo (JP); Takashi Kawamori, Tokyo (JP); Shinichiro Sukata, Tokyo (JP); Yoshihito Inaba, Tokyo (JP); and Keisuke Nishido, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 16/767,908
Filed by HITACHI CHEMICAL COMPANY, LTD., Tokyo (JP)
PCT Filed Nov. 29, 2018, PCT No. PCT/JP2018/044057
§ 371(c)(1), (2) Date May 28, 2020,
PCT Pub. No. WO2019/107508, PCT Pub. Date Jun. 6, 2019.
Claims priority of application No. PCT/JP2017/043363 (WO), filed on Dec. 1, 2017.
Prior Publication US 2020/0399506 A1, Dec. 24, 2020
Int. Cl. C09J 4/06 (2006.01); C09J 7/30 (2018.01); B32B 7/12 (2006.01); B32B 17/06 (2006.01); B32B 37/12 (2006.01); B32B 43/00 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); H01L 21/683 (2006.01)
CPC C09J 4/06 (2013.01) [B32B 7/12 (2013.01); B32B 17/06 (2013.01); B32B 37/12 (2013.01); B32B 43/006 (2013.01); C09J 7/30 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); H01L 21/6835 (2013.01); B32B 2037/1253 (2013.01); B32B 2310/0825 (2013.01); C09J 2203/326 (2013.01); C09J 2203/37 (2020.08); C09J 2409/00 (2013.01); C09J 2433/00 (2013.01); H01L 2221/68381 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A semiconductor device manufacturing method, the method comprising:
a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order; and
a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member,
wherein the supporting member is a glass substrate.