US 11,840,102 B2
Method for treating the surfaces of a part and associated facility
Michel Demarchi, Culoz (FR); and Jérome Boniface, Santes (FR)
Assigned to ROBO, Chambery (FR); and SMRC AUTOMOTIVE HOLDINGS NETHERLANDS B.V., Amsterdam (NL)
Appl. No. 17/054,111
Filed by ROBO, Chambery (FR); and SMRC AUTOMOTIVE HOLDINGS NETHERLANDS B.V., Amsterdam (NL)
PCT Filed Mar. 13, 2019, PCT No. PCT/EP2019/056313
§ 371(c)(1), (2) Date Nov. 9, 2020,
PCT Pub. No. WO2019/219273, PCT Pub. Date Nov. 21, 2019.
Claims priority of application No. 18 54024 (FR), filed on May 14, 2018.
Prior Publication US 2021/0402799 A1, Dec. 30, 2021
Int. Cl. B41J 3/407 (2006.01); B41J 11/00 (2006.01)
CPC B41J 3/4073 (2013.01) [B41J 11/00214 (2021.01)] 22 Claims
OG exemplary drawing
 
1. A method for surface-treating at least one surface of a part, said method comprising the steps of:
a measurement step, during which movement means, to which the part is secured at the level of a support forming part of the movement means, are moved at a speed of movement that varies according to the local geometry of the part, along a predetermined trajectory and, in a controlled manner, by a management and control unit, relative to deposition means which are not ejecting any substance, and during which a set of instantaneous velocities, over at least a fraction of the surface of the part, is determined by means of a measurement sensor controlled by the management and control unit, then data representative of this set of instantaneous velocities are transmitted and recorded in a computer,
a signal processing step, subsequent to the measurement step, during which a microcontroller determines, from the data representative of the set of instantaneous velocities that were previously transmitted by the computer to the microcontroller, a pulse train signal representative of a set of frequencies of ejection of a substance to be deposited by the deposition means on said at least a fraction of the surface of the part, and records the pulse train signal in a storage memory of the microcontroller,
a deposition step, subsequent to the signal processing step, during which the movement means are moved in a controlled manner, by the management and control unit relative to the deposition means, along the determined trajectory, and during which, in a synchronized manner, the microcontroller transmits the pulse train signal to the deposition means, and the deposition means eject at least one substance according to the received pulse train signal in order to deposit the substance on said at least a fraction of the surface of the part.