US 12,495,702 B2
Flexible organic light emitting element including encapsulation structure
Byoung-Hwa Kwon, Daejeon (KR); Chan-mo Kang, Daejeon (KR); Kukjoo Kim, Daejeon (KR); Gi Heon Kim, Daejeon (KR); Sujung Kim, Daejeon (KR); Sooji Nam, Daejeon (KR); Chunwon Byun, Daejeon (KR); Jin-Wook Shin, Daejeon (KR); Jong-Heon Yang, Daejeon (KR); Hyunsu Cho, Daejeon (KR); and Sukyung Choi, Daejeon (KR)
Assigned to Electronics and Telecommunications Research Institute, Daejeon (KR)
Filed by ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, Daejeon (KR)
Filed on Apr. 19, 2023, as Appl. No. 18/303,412.
Claims priority of application No. 10-2022-0066718 (KR), filed on May 31, 2022.
Prior Publication US 2023/0389400 A1, Nov. 30, 2023
Int. Cl. C09D 1/00 (2006.01); C09D 5/00 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); H10K 59/80 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01)
CPC H10K 59/873 (2023.02) [C09D 1/00 (2013.01); C09D 5/002 (2013.01); C09D 7/61 (2018.01); C09D 7/63 (2018.01); C09D 7/67 (2018.01); H10K 77/111 (2023.02); H10K 2102/311 (2023.02)] 13 Claims
OG exemplary drawing
 
1. A flexible organic light emitting element comprising:
a flexible substrate;
a circuit element layer on the flexible substrate;
an emission layer on the circuit element layer;
a first encapsulation structure between the flexible substrate and the circuit element layer;
a second encapsulation structure on the emission layer, and
a capping layer interposed between the emission layer and the second encapsulation structure,
wherein the first encapsulation structure includes a first inorganic layer and a first organic layer, which are sequentially stacked on an upper surface of the flexible substrate, and
the first organic layer includes a first polymer nanocomposite,
wherein the second encapsulation structure includes a second inorganic layer and a second organic layer, which are sequentially stacked on an upper surface of the capping layer, and
the second organic layer includes a second polymer nanocomposite.
 
9. A flexible organic light emitting element comprising:
a flexible substrate;
a circuit element layer on the flexible substrate;
an emission layer on the circuit element layer;
a first encapsulation structure between the flexible substrate and the circuit element layer; and
a second encapsulation structure on the emission layer,
wherein the first encapsulation structure includes a first protection layer, a first inorganic layer, and a first organic layer, which are sequentially stacked on an upper surface of the flexible substrate, and
the first organic layer is thicker than the first protection layer and the first inorganic layer.