US 12,495,655 B2
Optoelectronic package structure and method of manufacturing the same
Cheng-Hsuan Wu, Kaohsiung (TW); Chang-Yu Lin, Kaohsiung (TW); and Yu-Sheng Huang, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Mar. 26, 2024, as Appl. No. 18/617,589.
Application 18/617,589 is a continuation of application No. 17/367,052, filed on Jul. 2, 2021, granted, now 11,942,585.
Prior Publication US 2025/0306308 A1, Oct. 2, 2025
Int. Cl. G02B 6/42 (2006.01); G02B 6/12 (2006.01); H01L 23/00 (2006.01); H01L 23/488 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/4245 (2013.01) [G02B 6/12 (2013.01); G02B 6/4239 (2013.01); G02B 6/4274 (2013.01); H01L 23/488 (2013.01); H01L 24/08 (2013.01); H01L 25/167 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/08225 (2013.01); H01L 2924/1903 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An optoelectronic package structure, comprising:
an optical device;
a photonic component having a plurality of bonding pads and configured to be connected to the optical device;
a blocking structure disposed under the photonic component;
a filling material disposed between the plurality of bonding pads and not disposed between a bottom surface of the optical device and a lateral surface of the blocking structure in a cross-sectional view; and
a circuit structure disposed under the photonic component, the circuit structure being electrically connected to the photonic component through the plurality of the bonding pads,
wherein a width of one of the plurality of bonding pads is less than a width of the blocking structure; and
wherein the blocking structure electrically connects the circuit structure and the photonic component.