US 12,495,616 B2
Method for monitoring a switchable semiconductor component and monitoring device for a semiconductor component
Thomas Rapolder, Ebersberg (DE); and Michael Wortberg, Dorfer (DE)
Assigned to Lisa Draexlmaier GmbH, Vilsbiburg (DE)
Filed by Lisa Draexlmaier GmbH, Vilsbiburg (DE)
Filed on Jul. 20, 2022, as Appl. No. 17/869,110.
Claims priority of application No. 10 2021 118 817.2 (DE), filed on Jul. 21, 2021.
Prior Publication US 2023/0025128 A1, Jan. 26, 2023
Int. Cl. H10D 89/60 (2025.01)
CPC H10D 89/611 (2025.01) [H10D 89/911 (2025.01); H10D 89/931 (2025.01)] 9 Claims
OG exemplary drawing
 
1. A method for monitoring a switchable semiconductor component having a protective circuit connected in parallel to the semiconductor component, the method comprising:
tapping an electrical variable applied to the semiconductor component and the protective circuit; and
detecting damage to at least one of the semiconductor component and the protective circuit when the electrical variable is greater than a previously known critical value,
wherein the protective circuit comprises a suppressor diode, and the method further comprises:
tapping an electrical voltage at the suppressor diode connected in parallel to the semiconductor component; and
detecting damage to the suppressor diode when the electrical voltage is greater than a breakdown voltage plus a permitted voltage tolerance of the suppressor diode.