| CPC H10D 30/0243 (2025.01) [H01L 21/02164 (2013.01); H01L 21/02167 (2013.01); H10D 30/6211 (2025.01)] | 20 Claims |

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1. A semiconductor device comprising:
a first fin structure and a second fin structure protruding from a substrate;
a first epitaxial source/drain region in the first fin structure;
a second epitaxial source/drain region in the second fin structure;
a shallow trench isolation (STI) region between the first fin structure and the second fin structure;
a dummy fin disposed between the first epitaxial source/drain region and the second epitaxial source/drain region, wherein the dummy fin comprises a first dielectric material and a second dielectric material, the first dielectric material and the second dielectric material having carbon concentrations that are in a range from 15 percent to 25 percent by weight of carbon, wherein the first dielectric material has a greater percentage atomic carbon concentration than a percentage atomic carbon concentration of the second dielectric material; and
a dielectric liner disposed on sidewalls and a top surface of the STI region, wherein the dielectric liner is also disposed between the STI region and the dummy fin, wherein a third dielectric material of the STI region is different from a fourth dielectric material of the dielectric liner, wherein topmost surfaces of the dielectric liner are disposed below a top surface of the first dielectric material, a top surface of the second dielectric material, and a topmost surface of the first fin structure.
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