US 12,495,567 B2
Power semiconductor device and manufacturing method thereof
Ji Houn Jung, Seoul (KR); Dae Il Kim, Cheongji-si (KR); Han Seok Ko, Seoul (KR); and Ung Bi Son, Bucheon-si (KR)
Assigned to DB HiTek Co., Ltd., Bucheon-si (KR)
Filed by DB HiTek Co., Ltd., Bucheon-si (KR)
Filed on Mar. 14, 2023, as Appl. No. 18/183,438.
Claims priority of application No. 10-2022-0114148 (KR), filed on Sep. 8, 2022.
Prior Publication US 2024/0088260 A1, Mar. 14, 2024
Int. Cl. H10D 30/47 (2025.01); H10D 30/01 (2025.01); H10D 62/85 (2025.01); H10D 64/00 (2025.01); H10D 64/23 (2025.01)
CPC H10D 30/015 (2025.01) [H10D 30/475 (2025.01); H10D 64/111 (2025.01); H10D 64/251 (2025.01); H10D 62/8503 (2025.01)] 11 Claims
OG exemplary drawing
 
1. A power semiconductor device comprising:
a substrate;
a channel layer on the substrate;
a barrier layer on the channel layer, wherein the barrier layer comprises a plurality of isolation regions spaced apart from each other in a plan view, and each of the plurality of isolation regions comprises an insulation material;
a capping layer having a first conductivity type on the barrier layer;
a gate electrode on the capping layer;
a source electrode and a drain electrode on the barrier layer, spaced apart from the gate electrode;
an insulation film on the barrier layer, and
a field plate on the insulation film, the field plate being electrically connected to the drain electrode,
wherein the barrier layer is discontinuous from the source electrode to the drain electrode.