US 12,495,505 B2
Printed circuit board for phased array antenna transceiver assembly, transceiver assembly and radar
Li Chen, Shenzhen (CN); Shuping Shan, Shenzhen (CN); and Guodong Guo, Shenzhen (CN)
Assigned to SHENNAN CIRCUITS CO., LTD., Shenzhen (CN)
Filed by SHENNAN CIRCUITS CO.,LTD., Shenzhen (CN)
Filed on Feb. 6, 2024, as Appl. No. 18/433,761.
Application 18/433,761 is a continuation of application No. PCT/CN2021/142194, filed on Dec. 28, 2021.
Claims priority of application No. 202111022007.X (CN), filed on Sep. 1, 2021.
Prior Publication US 2024/0179852 A1, May 30, 2024
Int. Cl. H05K 3/46 (2006.01); G01S 13/02 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01)
CPC H05K 3/4602 (2013.01) [G01S 13/02 (2013.01); H05K 1/0209 (2013.01); H05K 3/0088 (2013.01); H05K 3/1258 (2013.01); G01S 2013/0245 (2013.01); H05K 2201/10098 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A printed circuit board for a phased array antenna transceiver assembly, comprising:
a microwave core board layer, operating in a first frequency band, wherein a chip carrying area is arranged on a side of the microwave core board layer, and the chip carrying area is configured to carry a chip;
a digital core board layer, operating in a second frequency band and stacked on another side of the microwave core board layer away from the chip carrying area; wherein an interlayer connecting path is arranged on the microwave core board layer and the digital core board layer, and the interlayer connecting path is connected to the chip carrying area; and
a heat dissipation member, embedded in the digital core board layer and connected to the chip carrying area.