US 12,495,500 B2
Flexible display module and manufacturing method thereof
Jiafan Shi, Beijing (CN); Liqiang Chen, Beijing (CN); Changbo Liu, Beijing (CN); Zuojia Wang, Beijing (CN); Qingsong Wang, Beijing (CN); Chao Zhou, Beijing (CN); Yongchun Jiang, Beijing (CN); Qian Yin, Beijing (CN); and Ziqi Song, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and Beijing BOE Technology Development Co., Ltd., Beijing (CN)
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Filed on Apr. 21, 2024, as Appl. No. 18/641,420.
Application 18/641,420 is a continuation of application No. 18/203,593, filed on May 30, 2023, granted, now 12,010,798.
Application 18/203,593 is a continuation of application No. 17/539,549, filed on Dec. 1, 2021, granted, now 11,706,872, issued on Jul. 18, 2023.
Claims priority of application No. 202110126902.X (CN), filed on Jan. 29, 2021; and application No. 202110349782.X (CN), filed on Mar. 31, 2021.
Prior Publication US 2024/0268029 A1, Aug. 8, 2024
Int. Cl. H05K 1/14 (2006.01); G09F 9/30 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/147 (2013.01) [G09F 9/301 (2013.01); H05K 1/0203 (2013.01); H05K 1/028 (2013.01); H05K 1/0298 (2013.01); H05K 1/189 (2013.01); H05K 2201/10128 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A flexible display module, comprising a flexible display panel, and a driving chip and a circuit board arranged on the flexible display panel,
wherein the flexible display panel comprises a display region and a bonding region arranged at a side of the display region opposite to a light-exiting side, and a bending region between the display region and the bonding region;
wherein the driving chip and the circuit board are in the bonding region;
wherein the flexible display module further comprises a flexible substrate supporting the flexible display panel, the flexible substrate comprises a first flexible substrate and a second flexible substrate, the first flexible substrate is coupled to one end of the bending region, and one end of the second flexible substrate is coupled to the other end of the bending region;
wherein the bonding region of the flexible display panel is on the second flexible substrate;
wherein the circuit board is coupled to the other end of the second flexible substrate at a first position;
wherein an orthographic projection of the driving chip onto a plane where the first flexible substrate is located and an orthographic projection of the bending region onto the plane where the first flexible substrate is located are both located on a same side of a first vertical line, and the first vertical line is a vertical line at the first position and perpendicular to the first flexible substrate;
wherein the driving chip is arranged on a side of the second flexible substrate away from the first flexible substrate;
wherein the circuit board comprises a first flexible printed circuit, and a first printed circuit board provided with a first electronic element and coupled to one end of the first flexible printed circuit, and the first flexible printed circuit is coupled to the bonding region of the flexible display panel;
wherein a first adhesive surrounding the driving chip is arranged on the second flexible substrate, and the first electronic element is adhered to the bonding region of the flexible display panel through the first adhesive.