US 12,494,846 B2
Optoelectronic assembly
David Allouche, Wilmington, DE (US); Michael Chu, Wilmington, DE (US); and Jonathan Ashbrook, Wilmington, DE (US)
Assigned to II-VI DELAWARE, INC., Wilmington, DE (US)
Filed by II-VI DELAWARE, INC., Wilmington, DE (US)
Filed on Aug. 16, 2023, as Appl. No. 18/450,879.
Claims priority of provisional application 63/489,984, filed on Mar. 13, 2023.
Prior Publication US 2024/0313861 A1, Sep. 19, 2024
Int. Cl. H04B 10/40 (2013.01)
CPC H04B 10/40 (2013.01) 34 Claims
OG exemplary drawing
 
1. An optical transceiver device, comprising:
a printed circuit board (PCB);
an integrated circuit (IC) substrate mounted on the PCB by a first plurality of electrical connections disposed between a first surface of the PCB and a first surface of the IC substrate, the IC substrate comprising active elements embedded in the IC substrate;
a vertical-cavity surface-emitting laser (VCSEL) mounted on a second surface of the IC substrate, opposite to the first surface of the IC substrate, with a second plurality of electrical connectors therebetween; and
an optical detector mounted adjacent to the VCSEL on the second surface of the IC substrate with a third plurality of electrical connectors therebetween;
wherein the IC substrate includes a plurality of conductive pillars extending along a first direction between the first surface of the IC substrate and the second surface of the IC substrate and a plurality of interconnection layers extending along a second direction substantially normal to the first direction, and
wherein at least one active element embedded in the IC substrate provides driver operations of the VCSEL and at least one electrical communication path between an active or passive element embedded in the IC substrate and at least one of the optical detector and the VCSEL is confined within the IC substrate.