US 12,494,769 B2
Packaged surface acoustic wave device with conductive pillar
Hironori Fukuhara, Ibaraki (JP); Rei Goto, Osaka (JP); and Keiichi Maki, Suita (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by Skyworks Solutions, Inc., Irvine, CA (US)
Filed on Aug. 2, 2022, as Appl. No. 17/816,982.
Claims priority of provisional application 63/237,894, filed on Aug. 27, 2021.
Claims priority of provisional application 63/237,942, filed on Aug. 27, 2021.
Claims priority of provisional application 63/237,905, filed on Aug. 27, 2021.
Prior Publication US 2023/0069327 A1, Mar. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H03H 9/25 (2006.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/10 (2006.01); H03H 9/145 (2006.01); H03H 9/64 (2006.01)
CPC H03H 9/25 (2013.01) [H03H 3/08 (2013.01); H03H 9/02574 (2013.01); H03H 9/1071 (2013.01); H03H 9/1092 (2013.01); H03H 9/145 (2013.01); H03H 9/64 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A packaged surface acoustic wave device comprising:
first and second conductive vias that extend through a support substrate and a piezoelectric layer;
at least a first interdigital transducer electrode and a second interdigital transducer electrode over the piezoelectric layer, the first interdigital transducer electrode having a first bus bar and a second bus bar with the first bus bar closer to the first conductive via than the second bus bar, the second interdigital transducer electrode having a third bus bar and a fourth bus bar, with the third bus bar closer to second conductive via than the fourth bus bar, the fourth bus bar closer to the second bus bar than the third bus bar;
a conductive structure positioned over the piezoelectric layer in an area between the first and second interdigital transducer electrodes, the conductive structure connected to the second bus bar with the fourth bus bar;
a roof structure over the first and second interdigital transducer electrodes and the conductive structure; and
at least first, second, and third conductive pillars, the first and third conductive pillars disposed between the support substrate and the roof structure and defining a hermetically sealed cavity above the first and second interdigital transducer electrodes and the conductive structure, the first conductive pillar forms at least a portion of a first electrical pathway between the first conductive via and the first bus bar, the second conductive pillar extending through the hermetically sealed cavity from the roof structure to the conductive structure to form at least a portion of a second electrical pathway between the second bus bar and the fourth bus bar, and the third conductive pillar forms a least a portion of a third electrical pathway between the second conductive via and the third bus bar.