US 12,494,564 B2
Radio frequency chip, signal transceiver, and communication device
Luqi Zhang, Shenzhen (CN); Kun Li, Chengdu (CN); Xianfeng Tang, Shenzhen (CN); and Yanxing Luo, Chengdu (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed on Mar. 7, 2023, as Appl. No. 18/180,085.
Application 18/180,085 is a continuation of application No. PCT/CN2021/093770, filed on May 14, 2021.
Claims priority of application No. 202010975335.0 (CN), filed on Sep. 16, 2020.
Prior Publication US 2023/0318166 A1, Oct. 5, 2023
Int. Cl. H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 1/50 (2006.01); H01Q 9/04 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01Q 1/38 (2013.01); H01Q 1/50 (2013.01); H01Q 9/0407 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio frequency chip, comprising:
a chip (200), that is configured to generate an electromagnetic signal or process an electromagnetic signal;
a coupling structure (100), that comprises:
a resonator (110) having a resonant cavity (112) and a groove (114), wherein an inner wall of the resonant cavity (112) is made of metal, one end of the resonant cavity (112) is opened on a top surface (1102) of the resonator (110), the other end of the resonant cavity is sealed by using a metal material, a cross section of the resonant cavity (112) is formed into a centro-symmetric shape, and the groove (114) connects an outer wall of the resonator (110) and an inner wall of the resonant cavity (112);
a redistribution layer (RDL) (120), arranged above the top surface (1102) and comprising an RDL dielectric layer (124);
a radiator (130), made of metal, formed into a centro-symmetric shape, arranged on a surface that is of the RDL dielectric layer (124) and that faces the resonator (110), and accommodated in the resonant cavity (112); and
a feeder (140), accommodated in the groove (114), wherein one end of the feeder (140) is connected to the chip (200), and the other end of the feeder (140) is inserted into the resonant cavity (112); and
a packaging structure (300), that is configured to package the chip (200) and cover the RDL (120), wherein a through hole (310) for accommodating the metal connector is formed on the packaging structure (300), one end of the metal connector is in contact with a surface that is of the RDL (120) and that faces away from the resonator (110), the other end of the metal connector is configured to connect to a polymer transmission cable, and a cross section of the through hole (310) is formed into a centro-symmetric shape;
wherein a symmetry center of the radiator (130), a symmetry center of the resonant cavity (112), and a symmetry center of the through hole (310) are coaxially arranged, and a deviation between cross-sectional sizes of the through hole (310) and the resonant cavity (112) is within a first preset range.