US 12,494,453 B2
Package-on-package assembly with wire bonds to encapsulation surface
Hiroaki Sato, Yokohama (JP); Teck-Gyu Kang, San Jose, CA (US); Belgacem Haba, Saratoga, CA (US); Philip R. Osborn, San Jose, CA (US); Wei-Shun Wang, Palo Alto, CA (US); Ellis Chau, San Jose, CA (US); Ilyas Mohammed, Santa Clara, CA (US); Norihito Masuda, Kanagawa (JP); Kazuo Sakuma, Iwaki (JP); Kiyoaki Hashimoto, Kanagawa (JP); Kurosawa Inetaro, Kanagawa (JP); and Tomoyuki Kikuchi, Kanagawa (JP)
Assigned to Adeia Semiconductor Solutions LLC, San Jose, CA (US)
Filed by Adeia Semiconductor Solutions LLC, San Jose, CA (US)
Filed on Oct. 13, 2023, as Appl. No. 18/380,053.
Application 13/792,521 is a division of application No. 13/462,158, filed on May 2, 2012, granted, now 8,618,659, issued on Dec. 31, 2013.
Application 18/380,053 is a continuation of application No. 17/867,554, filed on Jul. 18, 2022, granted, now 11,830,845.
Application 17/867,554 is a continuation of application No. 17/086,785, filed on Nov. 2, 2020, granted, now 11,424,211, issued on Aug. 23, 2022.
Application 17/086,785 is a continuation of application No. 16/778,899, filed on Jan. 31, 2020, granted, now 10,833,044, issued on Nov. 10, 2020.
Application 16/778,899 is a continuation of application No. 16/058,425, filed on Aug. 8, 2018, granted, now 10,593,643, issued on Mar. 17, 2020.
Application 16/058,425 is a continuation of application No. 15/628,851, filed on Jun. 21, 2017, granted, now 10,062,661, issued on Aug. 28, 2018.
Application 15/628,851 is a continuation of application No. 14/979,053, filed on Dec. 22, 2015, granted, now 9,691,731, issued on Jun. 27, 2017.
Application 14/979,053 is a continuation of application No. 14/564,640, filed on Dec. 9, 2014, granted, now 9,224,717, issued on Dec. 29, 2015.
Application 14/564,640 is a continuation of application No. 13/792,521, filed on Mar. 11, 2013, granted, now 9,093,435, issued on Jul. 28, 2015.
Claims priority of application No. 10-2011-0041843 (KR), filed on May 3, 2011.
Prior Publication US 2024/0203930 A1, Jun. 20, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 25/04 (2023.01); H01L 25/065 (2023.01); H01L 25/10 (2006.01); H01L 25/16 (2023.01); H10F 39/00 (2025.01); H01L 23/538 (2006.01)
CPC H01L 24/48 (2013.01) [H01L 23/13 (2013.01); H01L 23/3107 (2013.01); H01L 23/3128 (2013.01); H01L 23/4952 (2013.01); H01L 23/49811 (2013.01); H01L 24/18 (2013.01); H01L 24/73 (2013.01); H01L 25/043 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/16 (2013.01); H10F 39/804 (2025.01); H10F 39/806 (2025.01); H01L 21/56 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 24/45 (2013.01); H01L 24/49 (2013.01); H01L 2224/05599 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1713 (2013.01); H01L 2224/17179 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45101 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45155 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48455 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/49105 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/107 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01087 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/18165 (2013.01); H01L 2924/19107 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method comprising:
providing a substrate having a surface having electrically conductive elements;
disposing at least one microelectronic element overlying the surface of the substrate;
joining a first metal wire to a first electrically conductive element of the electrically conductive elements, wherein:
a first end of the first metal wire is bonded to the first electrically conductive element;
a second end of the first metal wire is opposite to the first end of the first metal wire and extends away from the substrate; and
the second end of the first metal wire is displaced a distance in a horizontal direction relative to the first end of the first metal wire bonded to the first electrically conductive element;
joining a second metal wire to a second electrically conductive element of the electrically conductive elements, wherein:
a first end of the second metal wire is bonded to the second electrically conductive element; and
a second end of the second metal wire is opposite to the first end of the second metal wire and is touching at least one of the first or second electrically conductive elements;
joining a third metal wire to a third electrically conductive element of the electrically conductive elements, wherein:
a first end of the third metal wire is bonded to the third electrically conductive element;
a second end of the third metal wire is opposite to the first end of the third metal wire and extends away from the substrate; and
the second end of the third metal wire is displaced the distance in the horizontal direction relative to the first end of the third metal wire bonded to the third electrically conductive element;
forming an encapsulation layer above the surface of the substrate, wherein:
the encapsulation layer covers the first metal wire, the second metal wire, and the third metal wire; and
the first metal wire, the second metal wire, and the third metal wire are spaced from one another by the encapsulation layer;
removing a portion of the encapsulation layer to expose the second end of the first metal wire, wherein removing the portion of the encapsulation layer to expose the second end of the first metal wire comprises forming one or more cavities in the encapsulation layer so that the second end of the first metal wire is exposed above a bottom surface of the one or more cavities in the encapsulation layer; and
providing an electrically conductive material on the encapsulation layer in electrical connection with the second end of the first metal wire.
 
9. A method comprising:
providing a substrate having a surface having electrically conductive elements, wherein the electrically conductive elements comprise a first electrically conductive element and a second electrically conductive element;
disposing at least one microelectronic element overlying the surface of the substrate;
joining metal wires to the electrically conductive elements, wherein:
the metal wires comprise a first metal wire;
portions of the metal wires extend upward from the substrate;
the first wire of the metal wires has a first end, a first portion, and a second end; and
the first end of the first wire is joined to the first electrically conductive element;
forming an encapsulation layer above the surface of the substrate, wherein the encapsulation layer covers the metal wires, and the metal wires are spaced from one another by the encapsulation layer;
removing a portion of the encapsulation layer to expose the first portion of the first metal wire and the second end of the first metal wire, the removing including forming one or more cavities in the encapsulation layer so that the first portion and the second end of the first metal wire are exposed above a bottom surface of the one or more cavities in the encapsulation layer; and
providing an electrically conductive material on the encapsulation layer directly contacting the first portion of the first metal wire.