US 12,494,407 B2
Power electronics converter with stacked carrier substrates
Uwe Waltrich, Forchheim (DE); Stanley Buchert, Herzogenaurach (DE); Marco Bohlländer, Hirschaid (DE); and Claus Müller, Wolfratshausen (DE)
Assigned to ROLLS-ROYCE DEUTSCHLAND LTD & CO KG, Blankenfelde-Mahlow (DE)
Filed by Rolls-Royce Deutschland Ltd & Co KG, Blankenfelde-Mahlow (DE)
Filed on Jan. 24, 2023, as Appl. No. 18/100,873.
Claims priority of application No. 10 2022 205 493.8 (DE), filed on May 31, 2022.
Prior Publication US 2023/0387821 A1, Nov. 30, 2023
Int. Cl. H01L 23/36 (2006.01); B60L 50/00 (2019.01); B64D 27/34 (2024.01); B64D 27/35 (2024.01); B64D 27/359 (2024.01); H01L 23/48 (2006.01); H02M 1/00 (2006.01); H02M 1/08 (2006.01); H02M 7/00 (2006.01); H02M 7/219 (2006.01); H02P 27/06 (2006.01); H03K 17/56 (2006.01); H05K 1/14 (2006.01); B64D 27/02 (2006.01)
CPC H01L 23/36 (2013.01) [B60L 50/00 (2019.02); B64D 27/34 (2024.01); B64D 27/35 (2024.01); B64D 27/359 (2024.01); H01L 23/48 (2013.01); H02M 1/0054 (2021.05); H02M 1/08 (2013.01); H02M 7/003 (2013.01); H02M 7/219 (2013.01); H02P 27/06 (2013.01); H03K 17/56 (2013.01); H05K 1/144 (2013.01); B60L 2200/10 (2013.01); B60L 2210/30 (2013.01); B64D 27/026 (2024.01)] 19 Claims
OG exemplary drawing
 
1. A power electronics converter comprising:
a first multi-layer planar carrier substrate defining an x-y direction parallel to a planar surface of the first multi-layer planar carrier substrate and a z-direction perpendicular to the x-y direction, wherein the first multi-layer planar carrier substrate has one or more electrically conductive layers extending in the x-y direction;
a second multi-layer planar carrier substrate spaced apart from the first multi-layer planar carrier substrate in a +z direction, wherein a planar surface of the second multi-layer planar carrier substrate is parallel to the planar surface of the first multi-layer planar carrier substrate, and wherein the second multi-layer planar carrier substrate has one or more electrically conductive layers extending in the x-y direction;
a converter commutation cell circuit comprising a plurality of commutation cell components, wherein commutation cell components of the plurality of commutation cell components are electrically connected together via the one or more electrically conductive layers of the first multi-layer planar carrier substrate and electrical connections extend in the z-direction, wherein the plurality of commutation cell components comprises one or more power semiconductor switching elements included in one or more power semiconductor prepackages, and wherein each power semiconductor prepackage comprises a power semiconductor switching element embedded in a solid insulating material;
one or more additional converter components electrically connected to the one or more electrically conductive layers of the second multi-layer planar carrier substrate; and
one or more further electrical connections extending in the z-direction connecting together at least one electrically conductive layer of the one or more of the electrically conductive layers of the first multi-layer planar carrier substrate and at least one electrically conductive layer of the one or more of the electrically conductive layers of the second multi-layer planar carrier substrate.