| CPC H01J 37/3244 (2013.01) [B08B 7/0035 (2013.01); B08B 13/00 (2013.01); C23F 4/00 (2013.01); H01J 37/32183 (2013.01); H01J 37/32862 (2013.01); H01J 2237/334 (2013.01)] | 7 Claims |

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1. A ceramic air inlet radio frequency connection type cleaning device, comprising a coupling window provided on a top of a chamber, a top ceramic air inlet nozzle located in a central region of the coupling window, and a three-dimensional coil placed above the coupling window, wherein the three-dimensional coil comprises two single three-dimensional coil bodies which are independent mutually at center and edge, and the two single three-dimensional coil bodies each have one end connected together to radio frequency and another end connected together and grounded; and comprising a power supply control device and a radio frequency cleaning mechanism, wherein:
the power supply control device comprises a power distribution box and is used for power supply switching;
the two single three-dimensional coil bodies of the three-dimensional coil are in connection with two circuits of the power distribution box, respectively, so as to perform etching of a wafer in the chamber; and
a negative pressure is generated by connecting the radio frequency to the radio frequency cleaning mechanism, such that plasma directly bombards a lower surface of the top ceramic air inlet nozzle to perform cleaning of the lower surface of the top ceramic air inlet nozzle,
wherein the radio frequency cleaning mechanism comprises a center air inlet joint portion, an edge insulated air inlet portion, a center radio frequency air inlet portion and the top ceramic air inlet nozzle connected in sequence, wherein
the top ceramic air inlet nozzle comprises a center insulated air inlet portion and a top ceramic air inlet portion, the center insulated air inlet portion is located inside the top ceramic air inlet portion, and a top of the center insulated air inlet portion extends into an air inlet passage of the center radio frequency air inlet portion,
the center air inlet joint portion, the edge insulated air inlet portion, and the center radio frequency air inlet portion each have a communicating central gas passage;
the center air inlet joint portion is grounded and passable for a cleaning gas, and the center radio frequency air inlet portion is connected to the radio frequency;
the radio frequency cleaning mechanism comprises a plurality of capillary tubes and a plurality of narrow gas passages, the plurality of capillary tubes are provided in the central gas passage of the edge insulated air inlet portion, the plurality of narrow gas passages are uniformly distributed on an edge of the center insulated air inlet portion and communicate with the central air inlet passage of the center radio frequency air inlet portion; and
wherein:
the power supply control device comprises a first radio frequency power supply, a radio frequency matcher, and a first radio frequency switching box connected in sequence, and switching between the etching of the wafer and the radio frequency cleaning mechanism is achieved by means of the RF switching box; or
the power supply control device comprises a second radio frequency power supply, a second radio frequency switching box, a first coil radio frequency matcher, and a first center radio frequency matcher connected to the radio frequency cleaning mechanism, wherein an output terminal of the second radio frequency power supply is connected to the second radio frequency switching box, and switching between the first coil radio frequency matcher and the first center radio frequency matcher is achieved by means of the second radio frequency switching box; or
the power supply control device comprises a coil radio frequency power supply, a center radio frequency power supply, a second coil radio frequency matcher, and a second center radio frequency matcher, wherein an output terminal of the coil radio frequency power supply is connected to the second coil radio frequency matcher, an output terminal the center radio frequency power supply is connected to the second center radio frequency matcher, and an output terminal of the second center radio frequency matcher is connected to the radio frequency cleaning mechanism.
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