| CPC H01B 5/14 (2013.01) [H01Q 1/2258 (2013.01); H01Q 9/0407 (2013.01)] | 18 Claims |

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1. A conductive mesh structure comprising:
a dielectric layer;
a first mesh pattern disposed on a top surface of the dielectric layer, the first mesh pattern comprising conductive lines that intersect each other;
a second mesh pattern disposed on the top surface of the dielectric layer, the second mesh pattern comprising dummy lines that intersect each other and segmented portions that cut portions of each of the dummy lines; and
separation portions separating the first mesh pattern and the second mesh pattern,
wherein a width of each of the separation portions is defined as a minimum separation distance between each of the conductive lines and each of the dummy lines adjacent to each of the conductive lines, and a width of the segmented portion is defined as a minimum separation distance between one ends of the dummy line cut by the segmented portion,
wherein a ratio of the width of each of the separation portions to the width of each of the segmented portions is in a range from 0.7 to 1.6,
wherein a ratio of the width of each of the separation portions to a line width of each of the conductive lines is in a range from 0.7 to 1.6.
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