US 12,494,080 B2
Devices configured for near-field ultrasonic imaging
Shiang-Chi Lin, Taoyuan (TW); Jessica Liu Strohmann, Cupertino, CA (US); and Hrishikesh Vijaykumar Panchawagh, Cupertino, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Mar. 20, 2024, as Appl. No. 18/611,365.
Claims priority of provisional application 63/494,152, filed on Apr. 4, 2023.
Prior Publication US 2024/0338964 A1, Oct. 10, 2024
Int. Cl. G06V 40/13 (2022.01); B06B 1/06 (2006.01)
CPC G06V 40/1306 (2022.01) [B06B 1/0688 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A foldable display device, comprising:
a display system including a display stack;
an ultrasonic fingerprint sensor system including an ultrasonic fingerprint sensor system stack; and
a stiffener layer residing between the display stack and the ultrasonic fingerprint sensor system stack, the stiffener layer having a stiffener layer thickness configured to allow the ultrasonic fingerprint sensor system to operate in a near-field mode having a peak frequency in a range from 1 megahertz (MHz) to 6 MHz, wherein the stiffener layer thickness corresponds to a transmission coefficient in a range from 10 percent to 30 percent for ultrasonic waves in the range from 1 MHz to 6 MHz.