US 12,493,053 B2
Precision, high bandwidth, switching attenuator
Julie A. Campbell, Beaverton, OR (US); Daniel G. Knierim, Beaverton, OR (US); and Barton T. Hickman, Portland, OR (US)
Assigned to TEKTRONIX, INC., Beaverton, OR (US)
Filed by TEKTRONIX, INC., Beaverton, OR (US)
Filed on Nov. 6, 2023, as Appl. No. 18/503,066.
Application 18/503,066 is a continuation of application No. 17/716,435, filed on Apr. 8, 2022, granted, now 11,808,786.
Claims priority of provisional application 63/196,381, filed on Jun. 3, 2021.
Claims priority of provisional application 63/172,375, filed on Apr. 8, 2021.
Prior Publication US 2024/0069065 A1, Feb. 29, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 1/04 (2006.01); G01R 27/28 (2006.01)
CPC G01R 1/0416 (2013.01) [G01R 1/0466 (2013.01); G01R 27/28 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a fixed substrate having at least two contact structures;
a movable substrate having at least two electrically conductive paths, wherein at least one of the conductive paths comprises an attenuated path including a first attenuator;
a housing containing the fixed substrate and the movable substrate;
a plurality of connectors in the housing, each connector connecting to one of the at least two contact structures to connect to ground and a spring contact, the plurality of connectors arranged to connect to at least one of the conductive paths depending upon a position of the movable substrate; and
a motorized stage in the housing operable to move the movable substrate to align one of the at least two conductive paths to form a connection between two of the connectors.