US 12,492,867 B2
Air shrouds with integrated heat exchanger
Abraham Palaty, Thrissur (IN); Vinodh Ramachandran, Bangalore (IN); Shu-Kwan Lau, Sunnyvale, CA (US); Shainish Nellikka, Bangalore (IN); Raja Murali Dhamodharan, Madurai (IN); and Danny D. Wang, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Apr. 26, 2022, as Appl. No. 17/730,038.
Prior Publication US 2023/0341186 A1, Oct. 26, 2023
Int. Cl. F28D 1/02 (2006.01); F28D 1/047 (2006.01); F28F 1/24 (2006.01)
CPC F28D 1/0226 (2013.01) [F28D 1/024 (2013.01); F28D 1/0477 (2013.01); F28F 1/24 (2013.01); F28D 2001/0286 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A heating module for a process chamber suitable for use in semiconductor manufacturing, the heating module comprising:
an outer housing including a sidewall extending to a lid;
a reflector plate disposed in the outer housing;
a plurality of heating lamps associated with the reflector plate; and
a first heat exchange module disposed in the outer housing between the reflector plate and the lid, the first heat exchange module including:
a plurality of first heat exchange tubes disposed between a first inner shroud and a first outer shroud; and
a baffle extending from the first outer shroud to the lid.