US 12,492,314 B2
Conductive composite film
Chen-Yang Shiang, Taoyuan (TW); and I-Hua Chen, Taoyuan (TW)
Assigned to DDP SPECIALTY ELECTRONIC MATERIALS US 9, LLC, Midland, MI (US)
Appl. No. 18/556,029
Filed by DDP Specialty Electronic Materials US9, LLC, Wilmington, DE (US)
PCT Filed Apr. 22, 2022, PCT No. PCT/US2022/071866
§ 371(c)(1), (2) Date Oct. 18, 2023,
PCT Pub. No. WO2022/226533, PCT Pub. Date Oct. 27, 2022.
Claims priority of provisional application 63/178,687, filed on Apr. 23, 2021.
Prior Publication US 2024/0218193 A1, Jul. 4, 2024
Int. Cl. C09D 5/24 (2006.01); C08J 7/04 (2020.01); C08J 7/044 (2020.01); C09D 7/61 (2018.01); C09D 183/04 (2006.01)
CPC C09D 5/24 (2013.01) [C08J 7/042 (2013.01); C08J 7/044 (2020.01); C09D 7/61 (2018.01); C09D 183/04 (2013.01); C08J 2383/04 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A conductive composite film comprising:
(A) a substrate,
(B) a silicone based reactive layer formed from a curable organosiloxane composition,
(C) at least one conductive layer and
(D) a silicone encapsulant layer;
wherein the curable organosiloxane composition comprises:
at least one (B-i) organosilicone compound represented by the following formula (I) or (II):

OG Complex Work Unit Chemistry
wherein each R1 is independently an alkyl group or an allyl group each independently having 1 to 16 carbon atoms, R2 is an alkyl group having 1 to 4 carbon atoms, x is an integer from 1 to 3, R4 is an alkyl group having 1 to 16 carbon atoms, R5 is an alkyl group having 1to 16 carbon atoms, and y is an integer from 0 to 4; and
at least one (B-ii) organic metal compound represented by the following formula (III),

OG Complex Work Unit Chemistry
wherein R3 is an allyl group having 1 to 10 carbon atoms.