US 12,491,572 B2
Heating device
Cédric Benaben, Toulouse (FR); and Stéphane Vitali, Toulouse (FR)
Assigned to SCHAEFFLER TECHNOLOGIES AG & CO. KG, Herzogenaurach (DE)
Appl. No. 16/489,749
Filed by Continental Automotive France, Toulouse (FR); and Continental Automotive GmbH, Hannover (DE)
PCT Filed May 25, 2018, PCT No. PCT/FR2018/051236
§ 371(c)(1), (2) Date Aug. 29, 2019,
PCT Pub. No. WO2018/220320, PCT Pub. Date Dec. 6, 2018.
Claims priority of application No. 1754757 (FR), filed on May 30, 2017.
Prior Publication US 2020/0061730 A1, Feb. 27, 2020
Int. Cl. B23K 1/018 (2006.01); B23K 3/047 (2006.01); B23K 101/42 (2006.01); H01L 23/00 (2006.01); H05K 13/04 (2006.01)
CPC B23K 1/018 (2013.01) [B23K 3/047 (2013.01); H01L 24/98 (2013.01); H05K 13/0486 (2013.01); B23K 2101/42 (2018.08)] 13 Claims
OG exemplary drawing
 
1. A heating device comprising:
a heating means comprising a body having a top surface, a bottom surface, and two side surfaces, the top surface and the bottom surface being contiguous surfaces configured to be arranged between an electronic component and a printed circuit board, the heating means being configured to reach a temperature at least equal to a melting point of a solder; and
electrical-connection means arranged on at least one of the top surface, the bottom surface, or the two side surfaces, the electrical-connection means being configured to be coupled to an electrical power supply,
wherein the heating device is configured to heat at least one soldered joint between the electronic component and the printed circuit board.