	US 12,491,532 B2
	Apparatus and method for treating substrate
Jun Young Choi, Cheonan-si (KR); Gui Su Park, Cheonan-si (KR); Young Jin Jang, Cheonan-si (KR); Eun Jung Lee, Cheonan-si (KR); and Jun Hyun Lim, Cheonan-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Jun. 28, 2023, as Appl. No. 18/342,797.
Claims priority of application No. 10-2022-0187891 (KR), filed on Dec. 28, 2022.
Prior Publication US 2024/0216940 A1, Jul. 4, 2024
Int. Cl. B05C 9/06 (2006.01); B05C 11/10 (2006.01); B05C 13/02 (2006.01); B05D 1/22 (2006.01)

CPC B05C 9/06 (2013.01) [B05C 11/1042 (2013.01); B05C 13/02 (2013.01); B05D 1/22 (2013.01)]

13 Claims

1. A substrate treating method comprising:

liquid treating a substrate with a first treating liquid; and

replacing the first treating liquid on the substrate with a second treating liquid,

wherein the replacing the first treating liquid with a second treating liquid includes providing the second treating liquid at a temperature lower than a freezing point of the first treating liquid.

12. A substrate treating method comprising:

treating a plurality of substrates with a first treating liquid by immersing the plurality of substrates in a first treating bath filled with the first treating liquid, the first treating liquid including a phosphoric acid;

transferring the plurality of substrates to a second treating bath; and

immersing the plurality of substrates in the second treating bath filled with a second treating liquid, the second treating liquid including a water, the second treating liquid replacing the first treating liquid on the plurality of substrates with the second treating liquid, and

wherein the first treating liquid is heated and then provided in the first treating bath, and

the second treating liquid in the second treating bath is provided at a temperature lower than a freezing point of the first treating liquid.