	US 11,839,044 B2
	Power electronics unit having an integrated current sensor for forming a module; and drive train
Linbo Tang, Baden-Baden (DE); Marco Bender, Sasbachwalden (DE); Matthias Kästle, Lauf (DE); and Jan-Ulrich Biskup, Sinzheim (DE)
Assigned to Schaeffler Technologies AG & Co. KG, Herzogenaurach (DE)
Filed by Schaeffler Technologies AG & Co. KG, Herzogenaurach (DE)
Filed on Feb. 24, 2023, as Appl. No. 18/173,860.
Application 18/173,860 is a continuation of application No. 17/050,486, granted, now 11,617,280, previously published as PCT/DE2019/100053, filed on Jan. 21, 2019.
Claims priority of application No. 102018109803.0 (DE), filed on Apr. 24, 2018.
Prior Publication US 2023/0199996 A1, Jun. 22, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/14 (2006.01); H02M 1/00 (2006.01); H02M 7/00 (2006.01)

CPC H05K 7/1432 (2013.01) [H02M 1/0009 (2021.05); H02M 7/003 (2013.01)]

16 Claims

1. A power electronics unit for an electric drive unit, the power electronics unit comprising: an electrically conductive carrier element; a power semiconductor module arranged on and directly fastened to the carrier element, the power semiconductor module is configured to convert a direct current into a three-phase alternating current; a conductor rail integrated with and directly connected to the carrier element and the power semiconductor module; and a current sensor configured to measure the alternating current and fastened directly to the conductor rail, wherein the carrier element is a lead frame.