CPC H04R 1/02 (2013.01) [B81B 7/0032 (2013.01); B81B 2201/0271 (2013.01); B81B 2203/019 (2013.01); H04R 2201/003 (2013.01)] | 22 Claims |
1. A sensor comprising:
a substrate having a first surface and an opposing second surface, the substrate defining a port that extends between the first surface and the second surface;
a microelectromechanical systems (MEMS) transducer disposed on the first surface of the substrate over the port;
in integrated circuit (IC);
a cover disposed on the substrate covering the MEMS transducer and the IC; and
an ingress protection element positioned to cover the port, the ingress protection element comprising a third surface facing an environment outside the sensor, a fourth opposite facing surface, a perimeter of the third surface, and a thickness defined between the third and fourth surfaces, wherein the perimeter lies within a plane, and at least a portion of the third surface does not lie within the plane.
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12. A sensor comprising:
a substrate;
a microelectromechanical systems (MEMS) transducer;
an integrated circuit (IC);
a cover disposed on the substrate covering the MEMS transducer and the IC, the cover having a first surface and a second surface, the cover defining a port that extends between the first surface and the second surface; and
an ingress protection element positioned to cover the port, the ingress protection element comprising a third surface facing an environment outside the sensor, a fourth opposite facing surface, a perimeter of the third surface, and a thickness defined between the third and fourth surfaces, wherein the perimeter lies within a plane, and at least a portion of the third surface does not lie within the plane.
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