CPC H01L 33/32 (2013.01) [H01L 33/007 (2013.01); H01L 33/0093 (2020.05); H01L 33/08 (2013.01); H01L 33/10 (2013.01); H01L 33/16 (2013.01); H01L 33/18 (2013.01)] | 20 Claims |
1. A semiconductor processing method comprising:
forming a nucleation layer on a semiconductor substrate;
forming first, second, and third gallium-and-nitrogen-containing regions on the nucleation layer;
porosifying the first gallium-and-nitrogen-containing region, without porosifiying the second and third gallium-and-nitrogen-containing regions;
forming a first active region on the porosified first gallium-and-nitrogen-containing region, and a second active region on the unporosified second gallium-and-nitrogen-containing region; and
forming a third active region on the unporosified third gallium-and-nitrogen-containing region.
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