US 11,837,575 B2
Bonding passive devices on active device dies to form 3D packages
Chen-Hua Yu, Hsinchu (TW); Kuo Lung Pan, Hsinchu (TW); Shu-Rong Chun, Hsinchu (TW); Chi-Hui Lai, Taichung (TW); Tin-Hao Kuo, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); and Chung-Shi Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Mar. 2, 2020, as Appl. No. 16/806,026.
Claims priority of provisional application 62/891,730, filed on Aug. 26, 2019.
Prior Publication US 2021/0066242 A1, Mar. 4, 2021
Int. Cl. H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2023.01); H01L 23/367 (2006.01)
CPC H01L 24/94 (2013.01) [H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/3672 (2013.01); H01L 23/49861 (2013.01); H01L 23/64 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package comprising:
a package substrate;
an interposer over and bonded to the package substrate;
a first wafer over and bonding to the interposer, wherein the first wafer comprises independent passive device dies therein;
a second wafer over and bonding to the first wafer, wherein the second wafer comprises active device dies therein;
a screw penetrating through the package substrate, the first wafer, and the second wafer; and
a bolt attached to the screw.