US 11,837,570 B2
Light emitting device package
June O Song, Seoul (KR); Ki Seok Kim, Seoul (KR); and Chang Man Lim, Seoul (KR)
Assigned to SUZHOU LEKIN SEMICONDUCTOR CO., LTD., Taicang (CN)
Filed by SUZHOU LEKIN SEMICONDUCTOR CO., LTD., Taicang (CN)
Filed on May 25, 2022, as Appl. No. 17/824,204.
Application 17/824,204 is a division of application No. 16/646,623, granted, now 11,373,973, previously published as PCT/KR2018/010827, filed on Sep. 14, 2018.
Claims priority of application No. 10-2017-0118981 (KR), filed on Sep. 15, 2017.
Prior Publication US 2022/0293548 A1, Sep. 15, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01)
CPC H01L 24/32 (2013.01) [H01L 33/486 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/502 (2013.01); H01L 2224/32237 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light emitting device package comprising:
a package body comprising a first package body and a second package body, the second package including a first opening, the second package body being disposed on a top surface of the first package body;
a light emitting device disposed in the first opening and including a first bonding part and a second bonding part;
a first conductor disposed below the first bonding part;
a second conductor disposed below the second bonding part;
a first conductive layer, different from the first conductor, directly contacting a bottom surface of the first bonding part, and disposed on each of a bottom and side surfaces of the first conductor; and
a second conductive layer, different from the second conductor, directly contacting a bottom surface of the second bonding part, and disposed on each of a bottom and side surfaces of the second conductor,
wherein the first conductor is electrically connected to the first bonding part,
wherein the second conductor is electrically connected to the second bonding part, and
wherein an entirety of the first conductor and an entirety of the second conductor are disposed below the top surface of the first package body.